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1 Ergebnisse
1
Superb sinterability of the Cu paste consisting of bimodal ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Hou, Bin
;
Huang, Hai-Jun
;
Wang, Chun-Meng
.. - p. 2064-2070 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00325
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Superb sinterability of the Cu paste consisting of bimodal size distribution Cu nanoparticles for low-temperature and pressureless sintering of large-area die attachment and the sintering mechanism</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816487&Exemplar=1&LAN=DE A1 Hou, Bin A1 Huang, Hai-Jun A1 Wang, Chun-Meng A1 Zhou, Min-Bo A1 Zhang, Xin-Ping YR 2022 SN 2377-5726 K1 Solvents K1 Semiconductor devices K1 Sintering K1 Atmosphere K1 Power electronics K1 Nanoscale devices K1 Microstructure K1 pressureless sintering K1 low temperature K1 Cu–Cu bonding K1 Cu nanoparticle K1 die attachment K1 reliability SP 2064 OP 2070 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00325 DO https://doi.org/10.1109/ECTC51906.2022.00325 SF ELIB - SuUB Bremen
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