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Optimization of 2.5D Organic Interposer Channel for Die and..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sitaraman, Srikrishna ; Verhaverbeke, Steven ; Banna, Samer... - p. 1316-1322 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00212