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1 Ergebnisse
1
Scalable Through Molding Interconnection realization for ad..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Plihon, Aurelia
;
Deschaseaux, Edouard
;
Franiatte, Remi
... - p. 2122-2127 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00335
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Scalable Through Molding Interconnection realization for advanced Fan Out Wafer Level Packaging applications
UL https://suche.suub.uni-bremen.de/peid=ieee-9816496&Exemplar=1&LAN=DE A1 Plihon, Aurelia A1 Deschaseaux, Edouard A1 Franiatte, Remi A1 Dechamp, Jerome A1 Vaudaine, Simon A1 Guillaume, Jennifer A1 Brunet-Manquat, Catherine A1 Moreau, Stephane A1 Coudrain, Perceval YR 2022 SN 2377-5726 K1 Resistance K1 Fans K1 Three-dimensional displays K1 Electronic components K1 Packaging K1 Electromagnetic compatibility K1 Robustness K1 TMI K1 EMC K1 FOWLP K1 daisy chain K1 RDL SP 2122 OP 2127 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00335 DO https://doi.org/10.1109/ECTC51906.2022.00335 SF ELIB - SuUB Bremen
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