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1 Ergebnisse
1
A study of failure mechanism in the formation of fine RDL p..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Jeon, Yoonyoung
;
Kim, Youngmin
;
Kim, Minju
... - p. 856-861 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00140
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A study of failure mechanism in the formation of fine RDL patterns and Vias for heterogeneous packages in chip last fan-out panel level packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816498&Exemplar=1&LAN=DE A1 Jeon, Yoonyoung A1 Kim, Youngmin A1 Kim, Minju A1 Lee, Sangyun A1 Lee, Hyundong A1 Lee, Changbo A1 Oh, Joon Seok YR 2022 SN 2377-5726 K1 Productivity K1 Mass production K1 Scalability K1 Packaging K1 Inspection K1 Filling K1 Reliability K1 Fan-out Panel Level Package K1 Chip-first K1 Chip-last K1 Semi-additive process K1 Fine patterning SP 856 OP 861 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00140 DO https://doi.org/10.1109/ECTC51906.2022.00140 SF ELIB - SuUB Bremen
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