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Advanced Thermal Integration for HPC Packages with Two-Phas..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Po-Yao ; Kuo, Sheng-Liang ; Yan, Kathy.. - p. 566-573 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00095