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1 Ergebnisse
1
Modeling High-Frequency and DC Path of Embedded Discrete Ca..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lee, Heeseok
;
Hwang, Kyojin
;
Kwon, Henry
... - p. 2217-2221 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00350
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package
UL https://suche.suub.uni-bremen.de/peid=ieee-9816502&Exemplar=1&LAN=DE A1 Lee, Heeseok A1 Hwang, Kyojin A1 Kwon, Henry A1 Hwang, Jisoo A1 Pak, Junso A1 Choi, Ju Yeon YR 2022 SN 2377-5726 K1 Conferences K1 Metals K1 Ceramic capacitors K1 Ceramics K1 Impedance K1 Substrates K1 Power Integrity K1 Power Delivery Network K1 multilayer ceramic capacitor K1 embedded capacitor K1 stacked capacitor SP 2217 OP 2221 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00350 DO https://doi.org/10.1109/ECTC51906.2022.00350 SF ELIB - SuUB Bremen
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