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1 Ergebnisse
1
A Study on Memory Stack Process by Hybrid Copper Bonding (H..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lee, Sanghoon
;
Jee, Youngkun
;
Park, Sangcheon
... - p. 1085-1089 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00175
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816504&Exemplar=1&LAN=DE A1 Lee, Sanghoon A1 Jee, Youngkun A1 Park, Sangcheon A1 Lee, Soohwan A1 Hwang, Bohee A1 Jo, Gyeongjae A1 Lee, Chungsun A1 Park, Jumyong A1 Jang, Aeni A1 Jung, HyunChul A1 Kim, Ilhwan A1 Kang, Dongwoo A1 Baek, Seungduk A1 Kim, Dae-Woo A1 Kang, Unbyung YR 2022 SN 2377-5726 K1 Performance evaluation K1 Three-dimensional displays K1 Stacking K1 Semiconductor device reliability K1 Force K1 Surface topography K1 Plasmas K1 Hybrid bonding K1 Die to Wafer K1 Multi-stack K1 TSV K1 Electrical and thermal performance SP 1085 OP 1089 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00175 DO https://doi.org/10.1109/ECTC51906.2022.00175 SF ELIB - SuUB Bremen
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