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1 Ergebnisse
1
Investigation of Reflow Effect and Empirical Lifetime Model..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Seo, Kwangwon
;
Rhew, Keunho
;
Jeon, Choongpyo
... - p. 1764-1769 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00278
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Investigation of Reflow Effect and Empirical Lifetime Modeling on the Board Level Solder Joint Reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816507&Exemplar=1&LAN=DE A1 Seo, Kwangwon A1 Rhew, Keunho A1 Jeon, Choongpyo A1 Choi, Youngsung A1 Bae, Jinsoo A1 Hwang, Yuchul A1 Kim, Hoosung A1 Pae, Sangwoo YR 2022 SN 2377-5726 K1 Semiconductor device modeling K1 Analytical models K1 Temperature K1 Statistical analysis K1 Thermomechanical processes K1 Mobile applications K1 Reliability K1 Board level Reliability K1 Solder Joint K1 LF35 K1 Thermal Cycling K1 Weibull Characterization K1 Reflow K1 Intermetallic Compound K1 Finite Element Analysis SP 1764 OP 1769 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00278 DO https://doi.org/10.1109/ECTC51906.2022.00278 SF ELIB - SuUB Bremen
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