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1 Ergebnisse
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Characterization of Non-Conductive Paste Materials (NCP) fo..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Horibe, Akihiro
;
Watanabe, Takahito
;
Marushima, Chinami
... - p. 625-630 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00105
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
UL https://suche.suub.uni-bremen.de/peid=ieee-9816511&Exemplar=1&LAN=DE A1 Horibe, Akihiro A1 Watanabe, Takahito A1 Marushima, Chinami A1 Mori, Hiroyuki A1 Kohara, Sayuri A1 Yu, Roy A1 Bergendahl, Marc A1 Magbitang, Teddie A1 Wojtecki, Rudy A1 Taneja, Divya A1 Godard, Maxime A1 Pulido, Claudia Cristina Barrera A1 de Sousa, Isabel A1 Sikka, Kamal A1 Hisada, Takashi YR 2022 SN 2377-5726 K1 Bridges K1 Temperature K1 Thermomechanical processes K1 Materials reliability K1 Silicon K1 Soldering K1 Stress K1 non-conductive paste K1 thermocompression bonding K1 heterogeneous integration K1 silicon bridge SP 625 OP 630 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00105 DO https://doi.org/10.1109/ECTC51906.2022.00105 SF ELIB - SuUB Bremen
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