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1 Ergebnisse
1
A study on bonding pad structure and layout for Fine pitch ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Kim, Juhyeon
;
Seo, Sun-Kyoung
;
Kim, Hyoeun
... - p. 712-715 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00119
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A study on bonding pad structure and layout for Fine pitch hybrid bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816514&Exemplar=1&LAN=DE A1 Kim, Juhyeon A1 Seo, Sun-Kyoung A1 Kim, Hyoeun A1 Kim, Yeongseon A1 Jo, Chajea A1 Kim, Dae-Woo YR 2022 SN 2377-5726 K1 Thermal expansion K1 Temperature dependence K1 Annealing K1 Three-dimensional displays K1 Temperature K1 Shape K1 Layout K1 3D Package K1 Hybrid Cu bonding K1 Interconnection K1 Fine pitch SP 712 OP 715 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00119 DO https://doi.org/10.1109/ECTC51906.2022.00119 SF ELIB - SuUB Bremen
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