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Chip-last FOWLP based antenna-in-package (FO-AiP) for 5G mm..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ahn, Klaus ; Park, Jade ; Lee, Bruce... - p. 1384-1389 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00222