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1 Ergebnisse
1
Hybrid Stacked-Die Package Solution for Extremely Small-For..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lee, Heeseok
;
Lee, Kyoung Min
;
Youn, Daehan
.. - p. 574-578 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00096
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Hybrid Stacked-Die Package Solution for Extremely Small-Form-Factor Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816517&Exemplar=1&LAN=DE A1 Lee, Heeseok A1 Lee, Kyoung Min A1 Youn, Daehan A1 Hwang, Kyojin A1 Kim, Junghwa YR 2022 SN 2377-5726 K1 System-in-package K1 Conferences K1 Electronic components K1 Silicon K1 Through-silicon vias K1 System in package (SIP) K1 Package on package (POP) K1 Fan-out package K1 stacked die package K1 face-up K1 face-down K1 face-to-face K1 face-to-back K1 back-to-back K1 hybrid stacked die package (HSDP) K1 3D IC SP 574 OP 578 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00096 DO https://doi.org/10.1109/ECTC51906.2022.00096 SF ELIB - SuUB Bremen
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