I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Liao, Po Yu
;
Ho, Ian
;
Lai, David
... - p. 182-186 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00039
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (Digital Image Correlation) and Shadow Moiré Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816520&Exemplar=1&LAN=DE A1 Liao, Po Yu A1 Ho, Ian A1 Lai, David A1 Wang, Yu-Po A1 Chen, Karen A1 Shih, Hsin-Chih A1 Chen, Dao-Long A1 Tamg, David YR 2022 SN 2377-5726 K1 Thermal expansion K1 Semiconductor device measurement K1 Correlation K1 Three-dimensional displays K1 5G mobile communication K1 Digital images K1 Layout K1 3D digital image correlation (DIC) K1 Shadow Moiré (SM) K1 Interface Analysis (IA) SP 182 OP 186 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00039 DO https://doi.org/10.1109/ECTC51906.2022.00039 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
