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1 Ergebnisse
1
Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Liao, Po Yu
;
Ho, Ian
;
Lai, David
... - p. 182-186 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00039
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (Digital Image Correlation) and Shadow Moiré Application
UL https://suche.suub.uni-bremen.de/peid=ieee-9816520&Exemplar=1&LAN=DE A1 Liao, Po Yu A1 Ho, Ian A1 Lai, David A1 Wang, Yu-Po A1 Chen, Karen A1 Shih, Hsin-Chih A1 Chen, Dao-Long A1 Tamg, David YR 2022 SN 2377-5726 K1 Thermal expansion K1 Semiconductor device measurement K1 Correlation K1 Three-dimensional displays K1 5G mobile communication K1 Digital images K1 Layout K1 3D digital image correlation (DIC) K1 Shadow Moiré (SM) K1 Interface Analysis (IA) SP 182 OP 186 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00039 DO https://doi.org/10.1109/ECTC51906.2022.00039 SF ELIB - SuUB Bremen
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