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1 Ergebnisse
1
Characterization of Low Loss Dielectric Materials for High-..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lee, Tzu Nien
;
Lau, John H
;
Ko, Cheng-Ta
... - p. 2222-2229 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00351
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Characterization of Low Loss Dielectric Materials for High-Speed and High-Frequency Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816523&Exemplar=1&LAN=DE A1 Lee, Tzu Nien A1 Lau, John H A1 Ko, Cheng-Ta A1 Xia, Tim A1 Lin, Eagle A1 Yang, Kai-Ming A1 Lin, Puru Bruce A1 Peng, Chia-Yu A1 Chang, Leo A1 Chen, Jia Shiang A1 Fang, Yi-Hsiu A1 Liao, Li-Yueh A1 Charn, Edward A1 Wang, Jason A1 Tseng, Tzyy-Jang YR 2022 SN 2377-5726 K1 Impedance measurement K1 Simulation K1 Dielectric materials K1 Dielectric losses K1 Network analyzers K1 Insertion loss K1 Dielectric loss measurement K1 dielectric materials K1 high-speed and high-frequency K1 insertion loss and return loss K1 dissipation factor K1 dielectric constant SP 2222 OP 2229 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00351 DO https://doi.org/10.1109/ECTC51906.2022.00351 SF ELIB - SuUB Bremen
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