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1 Ergebnisse
1
Reliability of Ag bonding wires and its coated variants fro..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Flauta, Randolph
;
Joy Garete, April
;
Luke Farrugia, Mark
.. - p. 2071-2077 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00326
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Reliability of Ag bonding wires and its coated variants from the perspective of IMC degradation and its correlation to wire and epoxy molding compound material properties under corrosive environment</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816526&Exemplar=1&LAN=DE A1 Flauta, Randolph A1 Joy Garete, April A1 Luke Farrugia, Mark A1 Sekaran, Sreetharan A1 Chen, Haibin YR 2022 SN 2377-5726 K1 Degradation K1 Gold K1 Sensitivity K1 Corrosion K1 Wires K1 Microstructure K1 Compounds K1 bonding wire K1 material analysis K1 Au-coated Ag wire K1 IMC degradation SP 2071 OP 2077 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00326 DO https://doi.org/10.1109/ECTC51906.2022.00326 SF ELIB - SuUB Bremen
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