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Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),

Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022

Link: https://doi.org/10.1109/ECTC51906.2022.00179

RT 
T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-9816529&Exemplar=1&LAN=DE
				
A1 Derakhshandeh, Jaber
A1 Beyne, Eric
A1 Beyer, Gerald
A1 Capuz, Giovanni
A1 Cherman, Vladimir
A1 De Preter, Inge
A1 Gerets, Carine
A1 Shafahian, Ehsan
A1 Kennes, Koen
A1 Jamieson, Geraldine
A1 Cochet, Tom
A1 Webers, Tomas
A1 Tobback, Bert
A1 Van der Plas, Geert
A1 La Tulipe, Douglas Charles
A1 Phommahaxay, Alain
A1 Miller, Andy
YR 2022
SN 2377-5726
K1 Wafer bonding
K1 Performance evaluation
K1 Semiconductor device reliability
K1 Stacking
K1 Electronic components
K1 Materials reliability
K1 Plating
K1 TBM (temporary bonding material)
K1 TCB
K1 Low temperature damascene processing on wafer BS
K1 spacer and solder bumps
K1 intermetallic compound
K1 3D die to wafer stacking
K1 wafer to wafer bonding
SP 1108
OP 1113
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00179
DO https://doi.org/10.1109/ECTC51906.2022.00179
SF ELIB - SuUB Bremen

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