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1 Ergebnisse
1
Low temperature backside damascene processing on temporary ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Derakhshandeh, Jaber
;
Beyne, Eric
;
Beyer, Gerald
... - p. 1108-1113 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00179
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
UL https://suche.suub.uni-bremen.de/peid=ieee-9816529&Exemplar=1&LAN=DE A1 Derakhshandeh, Jaber A1 Beyne, Eric A1 Beyer, Gerald A1 Capuz, Giovanni A1 Cherman, Vladimir A1 De Preter, Inge A1 Gerets, Carine A1 Shafahian, Ehsan A1 Kennes, Koen A1 Jamieson, Geraldine A1 Cochet, Tom A1 Webers, Tomas A1 Tobback, Bert A1 Van der Plas, Geert A1 La Tulipe, Douglas Charles A1 Phommahaxay, Alain A1 Miller, Andy YR 2022 SN 2377-5726 K1 Wafer bonding K1 Performance evaluation K1 Semiconductor device reliability K1 Stacking K1 Electronic components K1 Materials reliability K1 Plating K1 TBM (temporary bonding material) K1 TCB K1 Low temperature damascene processing on wafer BS K1 spacer and solder bumps K1 intermetallic compound K1 3D die to wafer stacking K1 wafer to wafer bonding SP 1108 OP 1113 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00179 DO https://doi.org/10.1109/ECTC51906.2022.00179 SF ELIB - SuUB Bremen
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