Merkliste 
 1 Ergebnisse 
 
1

Cu/Co metaconductor based highly energy-efficient bonding w..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jeon, Saeyeong ; Kim, Hae-In ; Lee, Woosol. - p. 1442-1445 , 2022