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Fan-out Wafer Level Package for Memory Applications:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Son, Ho-Young ; Sung, Ki-Jun ; Choi, Bok-Kyu.. - p. 1349-1354 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00217