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1 Ergebnisse
1
Development of Two-Tier FO-WLP AiPs for Automotive Radar Ap..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Ho, Soon Wee
;
Hsiang-Yao, Hsiao
;
Long, Lau Boon
... - p. 1376-1383 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00221
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Development of Two-Tier FO-WLP AiPs for Automotive Radar Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816534&Exemplar=1&LAN=DE A1 Ho, Soon Wee A1 Hsiang-Yao, Hsiao A1 Long, Lau Boon A1 Siang, Sharon Lim Pei A1 Guan, Lim Teck A1 Chong, Chai Tai YR 2022 SN 2377-5726 K1 Fabrication K1 Semiconductor device reliability K1 Materials reliability K1 Radar antennas K1 Radar applications K1 Compounds K1 Bonding K1 Antenna in Package K1 Fan-out wafer level Package K1 Automotive Radar SP 1376 OP 1383 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00221 DO https://doi.org/10.1109/ECTC51906.2022.00221 SF ELIB - SuUB Bremen
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