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1 Ergebnisse
1
Dimensional Parameters Controlling Capillary Underfill Flow..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Marushima, Chinami
;
Aoki, Toyohiro
;
Nakamura, Koki
... - p. 586-590 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00098
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816540&Exemplar=1&LAN=DE A1 Marushima, Chinami A1 Aoki, Toyohiro A1 Nakamura, Koki A1 Miyazawa, Risa A1 Horibe, Akihiro A1 de Sousa, Isabel A1 Sikka, Kamal A1 Hisada, Takashi YR 2022 SN 2377-5726 K1 Bridges K1 Geometry K1 Visualization K1 Thermal expansion K1 Force K1 Glass K1 Silicon K1 Direct Bonded Heterogeneous Integration K1 Si bridge K1 Capillary underfill SP 586 OP 590 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00098 DO https://doi.org/10.1109/ECTC51906.2022.00098 SF ELIB - SuUB Bremen
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