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1 Ergebnisse
1
A comparative study of the thermomechanical reliability of ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Pan, Ke
;
Okoro, Chukwudi
;
Lai, Yangyang
... - p. 1211-1217 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00194
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A comparative study of the thermomechanical reliability of fully-filled and conformal through-glass via</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816541&Exemplar=1&LAN=DE A1 Pan, Ke A1 Okoro, Chukwudi A1 Lai, Yangyang A1 Joshi, Dhananjay A1 Park, Seungbae A1 Pollard, Scott YR 2022 SN 2377-5726 K1 Temperature measurement K1 Creep K1 Thermomechanical processes K1 Two dimensional displays K1 Glass K1 Copper K1 Reliability K1 Through-glass via (TGV) K1 thermomechanical reliability K1 in-plane deformation K1 copper protrusion SP 1211 OP 1217 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00194 DO https://doi.org/10.1109/ECTC51906.2022.00194 SF ELIB - SuUB Bremen
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