I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Heterogeneously Integrated Quantum Chip Interposer Packagin:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Kudalippalliyalil, Ramesh
;
Chandran, Sujith
;
Jaiswal, Akhilesh
.. - p. 1869-1874 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00294
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Heterogeneously Integrated Quantum Chip Interposer Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816545&Exemplar=1&LAN=DE A1 Kudalippalliyalil, Ramesh A1 Chandran, Sujith A1 Jaiswal, Akhilesh A1 Wang, Kang L. A1 Jacob, Ajey P. YR 2022 SN 2377-5726 K1 Computers K1 Fault tolerance K1 Optical interconnections K1 Qubit K1 Optical device fabrication K1 Fault tolerant systems K1 Computer architecture K1 Quantum Interposer K1 Quantum Optical Interconnects K1 Superconducting Quantum Computer K1 Quantum Frequency Transducer K1 Topological Interconnects K1 Heterogeneous Packaging K1 Quantum Photonics K1 Interposer Packaging SP 1869 OP 1874 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00294 DO https://doi.org/10.1109/ECTC51906.2022.00294 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
