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1 Ergebnisse
1
Novel method for NCF flow simulation in HBM thermal compres..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Hong, Jong Pa
;
Lee, Su Chang
;
Han, Sun Woo
... - p. 519-523 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00088
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Novel method for NCF flow simulation in HBM thermal compression bonding process to optimize the NCF shape</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816548&Exemplar=1&LAN=DE A1 Hong, Jong Pa A1 Lee, Su Chang A1 Han, Sun Woo A1 Oh, Sang Kun A1 Park, Sang Sik A1 Kang, Hyeong Mun A1 Kim, Won Keun A1 Kim, Kil Soo A1 Oh, Dan YR 2022 SN 2377-5726 K1 Viscosity K1 Temperature distribution K1 Shape K1 Lamination K1 Stacking K1 Layout K1 Predictive models K1 HBM K1 NCF K1 Fillet shape K1 Simulation K1 CFD K1 Flow K1 Hele-Shaw SP 519 OP 523 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00088 DO https://doi.org/10.1109/ECTC51906.2022.00088 SF ELIB - SuUB Bremen
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