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1 Ergebnisse
1
Reconstructing more sinterable surfaces for copper nanopart..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Zhang, Yudui
;
Wang, Chuncheng
;
Yao, Yue
... - p. 1668-1673 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00263
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Reconstructing more sinterable surfaces for copper nanoparticles to form high-strength Cu-Cu joints in air atmosphere</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816561&Exemplar=1&LAN=DE A1 Zhang, Yudui A1 Wang, Chuncheng A1 Yao, Yue A1 Zhao, Tao A1 Zhu, Pengli A1 Sun, Rong A1 Xu, Liang YR 2022 SN 2377-5726 K1 Performance evaluation K1 Surface reconstruction K1 Solvents K1 X-ray scattering K1 Surface resistance K1 Sintering K1 Packaging K1 surface treatment K1 die attachment K1 sintering in air atmosphere K1 bonding K1 Cu-Cu joint K1 surface reconstruction SP 1668 OP 1673 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00263 DO https://doi.org/10.1109/ECTC51906.2022.00263 SF ELIB - SuUB Bremen
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