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Assessment of Thermal-aware Floorplans in a 3D IC for Serve..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jung, Ki Wook ; Cho, Eunho ; Jo, Sungeun... - p. 1036-1047 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00169