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Dry etch processing in fan-out panel-level packaging - An a..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Schein, Friedrich-Leonhard
;
Voigt, Christian
;
Gerhold, Lutz
... - p. 1518-1523 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00242
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Dry etch processing in fan-out panel-level packaging - An application for high-density vertical interconnects and beyond</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816568&Exemplar=1&LAN=DE A1 Schein, Friedrich-Leonhard A1 Voigt, Christian A1 Gerhold, Lutz A1 Tsigaras, Ioannis A1 Elghazzali, Mohamed A1 Sawamoto, Hirofumi A1 Strolz, Ewald A1 Rettenmeier, Roland A1 Kahle, Ruben A1 Bottcher, Lars YR 2022 SN 2377-5726 K1 Shape K1 Conferences K1 Lithography K1 Imaging K1 Electronic components K1 Packaging K1 Etching K1 reactive-ion etching K1 plasma etching K1 fan-out panel-level packaging K1 vertical interconnects K1 build-up film SP 1518 OP 1523 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00242 DO https://doi.org/10.1109/ECTC51906.2022.00242 SF ELIB - SuUB Bremen
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