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1 Ergebnisse
1
RF Characterization in Range of 18GHz in Fan-out Package St..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Ha, Eun
;
Jeong, Haksan
;
Min, Kyung Deuk
.. - p. 2002-2007 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00315
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
RF Characterization in Range of 18GHz in Fan-out Package Structure Molded by Epoxy Molding Compound with EMI Shielding Property
UL https://suche.suub.uni-bremen.de/peid=ieee-9816572&Exemplar=1&LAN=DE A1 Ha, Eun A1 Jeong, Haksan A1 Min, Kyung Deuk A1 Kim, Kyung-Yeol A1 Jung, Seung-Boo YR 2022 SN 2377-5726 K1 Radio frequency K1 Electromagnetic interference K1 Resonant frequency K1 Electromagnetic compatibility K1 Propagation losses K1 Iron K1 Coplanar waveguides K1 component K1 Fan-out wafer level package K1 Epoxy mold compound K1 Shielding effectiveness K1 permittivity K1 Co-planar waveguide SP 2002 OP 2007 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00315 DO https://doi.org/10.1109/ECTC51906.2022.00315 SF ELIB - SuUB Bremen
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