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1 Ergebnisse
1
High Density Thin Film Flex Technology for Advanced Packagi..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Zoschke, Kai
;
Oppermann, Hermann
;
Wohrmann, Markus
... - p. 1010-1018 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00165
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>High Density Thin Film Flex Technology for Advanced Packaging Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816574&Exemplar=1&LAN=DE A1 Zoschke, Kai A1 Oppermann, Hermann A1 Wohrmann, Markus A1 Kallmayer, Christine A1 Tschoban, Christian A1 Krohnert, Kevin A1 Lopper, Christina A1 Jaeger, Danny A1 Lutz, Mario A1 Wunsch, Olaf YR 2022 SN 2377-5726 K1 Integrated circuits K1 Gold K1 Flexible printed circuits K1 Wires K1 Radar K1 Packaging K1 Routing K1 thin film flex K1 thin chip embedding K1 high density fine pitch routing K1 polymer interposer SP 1010 OP 1018 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00165 DO https://doi.org/10.1109/ECTC51906.2022.00165 SF ELIB - SuUB Bremen
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