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1 Ergebnisse
1
Functional Interposer Embedded with Multi-Terminal Si Capac..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Satake, Yoshiaki
;
Funaki, Tatsuya
;
Kobinata, Kyosuke
... - p. 283-288 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00053
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Functional Interposer Embedded with Multi-Terminal Si Capacitor for 2.5D/3D Applications Using Planarization and Bumpless Chip-on-Wafer (COW)
UL https://suche.suub.uni-bremen.de/peid=ieee-9816575&Exemplar=1&LAN=DE A1 Satake, Yoshiaki A1 Funaki, Tatsuya A1 Kobinata, Kyosuke A1 Matsuno, Hitoshi A1 Hidaka, Seiji A1 Abe, Shunsuke A1 Ito, Hiroyuki A1 Hsiao, Chih-Cheng A1 Li, Sheng Yi A1 Kim, Youngsuk A1 Ohba, Takayuki YR 2022 SN 2377-5726 K1 Resistance K1 Performance evaluation K1 Three-dimensional displays K1 Planarization K1 Semiconductor devices K1 Capacitors K1 Cows K1 multi-terminal K1 Si capacitor K1 bumpless K1 Chip-on-Wafer K1 (COW) K1 functional interposer K1 ESL K1 ESR K1 TSV SP 283 OP 288 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00053 DO https://doi.org/10.1109/ECTC51906.2022.00053 SF ELIB - SuUB Bremen
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