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1 Ergebnisse
1
A Laser Dicing Method for Plus-Shaped Dies for Heterogenous..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Jain, Aakrati
;
Sikka, Kamal
;
Li, Shidong
... - p. 24-29 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00012
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816577&Exemplar=1&LAN=DE A1 Jain, Aakrati A1 Sikka, Kamal A1 Li, Shidong A1 Gomez, Juan-Manuel A1 Bergendahl, Marc A1 Skordas, Spyridon A1 Van Borkulo, Jeroen A1 Doll, Roman A1 Biesheuvel, Kees A1 Mueller, Mark YR 2022 SN 2377-5726 K1 Particle beams K1 Shape K1 Fixtures K1 Laser modes K1 Plasmas K1 Finite element analysis K1 Laser beams K1 dicing K1 laser dicing K1 non-rectilinear chips K1 heterogeneous integration K1 Artificial Intelligence (AI) SP 24 OP 29 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00012 DO https://doi.org/10.1109/ECTC51906.2022.00012 SF ELIB - SuUB Bremen
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