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1 Ergebnisse
1
3D Embedded Power Package Module to Integrate Various Power..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Kim, Byong Jin
;
Jeon, HyeongIl
;
Park, DaeYoung
... - p. 289-295 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00054
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>3D Embedded Power Package Module to Integrate Various Power Systems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816579&Exemplar=1&LAN=DE A1 Kim, Byong Jin A1 Jeon, HyeongIl A1 Park, DaeYoung A1 Kim, Gi Jeong A1 Cho, Nam-Hee A1 Khim, Jin Young YR 2022 SN 2377-5726 K1 Integrated circuits K1 Insulated gate bipolar transistors K1 Three-dimensional displays K1 Multichip modules K1 Lead K1 Electronic packaging thermal management K1 Power systems K1 Embedded power module K1 EPM K1 3D integration K1 system design flexibility K1 routable (thin) molded lead frame (rtMLF) K1 Embedded package K1 half bridge K1 full bridge K1 powertrain SP 289 OP 295 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00054 DO https://doi.org/10.1109/ECTC51906.2022.00054 SF ELIB - SuUB Bremen
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