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1 Ergebnisse
1
A Study on Warpage and Reflow Profile for Extreme Extension..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Shin, Jiwon
;
Woo, Kwangbok
;
Kwon, Donguk
... - p. 1158-1162 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00187
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816580&Exemplar=1&LAN=DE A1 Shin, Jiwon A1 Woo, Kwangbok A1 Kwon, Donguk A1 Kim, Youngja A1 Lee, Youngmin A1 Kang, Dongwoo A1 Sahoo, Krutikesh A1 Ren, Haoxiang A1 Huang, Yu-Pei A1 Shah, Ujash A1 Yang, Yutao A1 Kuchhangi, Ankit A1 Iyer, Subramanian S. YR 2022 SN 2377-5726 K1 Heating systems K1 Temperature K1 Terminology K1 Conferences K1 Electronic components K1 Prediction methods K1 Indexes K1 Flip chip K1 Reflow profile K1 Soak time K1 TNW index K1 surface evolver K1 fine pitch SP 1158 OP 1162 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00187 DO https://doi.org/10.1109/ECTC51906.2022.00187 SF ELIB - SuUB Bremen
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