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1 Ergebnisse
1
Influence of micro voids in flip chip bump on electro-migra..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Murayama, Kei
;
Oon Lee, Kor
;
Ono, Toshiaki
... - p. 1144-1152 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00185
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Influence of micro voids in flip chip bump on electro-migration reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816582&Exemplar=1&LAN=DE A1 Murayama, Kei A1 Oon Lee, Kor A1 Ono, Toshiaki A1 Oi, Kiyoshi A1 Pei Lim, Sze A1 Yeo, Yvonne A1 Sweatman, Keith A1 Martell, Steven R. A1 Shimamoto, Haruo A1 Tsuriya, Masahiro YR 2022 SN 2377-5726 K1 Micrometers K1 Conferences K1 Electronic components K1 Conductivity K1 Mathematical models K1 Flip-chip devices K1 Reliability K1 micro voids K1 electro-migration K1 crystal orientation K1 IMCs SP 1144 OP 1152 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00185 DO https://doi.org/10.1109/ECTC51906.2022.00185 SF ELIB - SuUB Bremen
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