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1 Ergebnisse
1
Observation of Fatigue and Creep Ratcheting Failure in Sold..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Osmanson, Allison T.
;
Kim, Yi Ram
;
Kim, Choong-Un
... - p. 1465-1471 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00234
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Observation of Fatigue and Creep Ratcheting Failure in Solder Joints under Pulsed Direct Current Electromigration Testing</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816583&Exemplar=1&LAN=DE A1 Osmanson, Allison T. A1 Kim, Yi Ram A1 Kim, Choong-Un A1 Thompson, Patrick F. A1 Chen, Qiao A1 Ankamah-Kusi, Sylvester YR 2022 SN 2377-5726 K1 Scanning electron microscopy K1 Creep K1 Failure analysis K1 Fatigue K1 Finite element analysis K1 Kinetic theory K1 Plastics K1 Finite Element Method K1 Wafer-Level Chip Scale Package K1 Thermal Fatigue K1 Creep Ratcheting K1 Electromigration K1 Pulsed-DC SP 1465 OP 1471 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00234 DO https://doi.org/10.1109/ECTC51906.2022.00234 SF ELIB - SuUB Bremen
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