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1 Ergebnisse
1
Inlet/outlet induced failures during flip-chip bonding of l..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Du, Jianyu
;
Yang, Yuchi
;
Yu, Huaiqiang
... - p. 1805-1810 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00284
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Inlet/outlet induced failures during flip-chip bonding of large area chip with embedded microchannels</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816587&Exemplar=1&LAN=DE A1 Du, Jianyu A1 Yang, Yuchi A1 Yu, Huaiqiang A1 Xu, Han A1 Zheng, Deyin A1 Wang, Qi A1 Kang, Jiajie A1 Wang, Wei YR 2022 SN 2377-5726 K1 Liquids K1 Shape K1 Thermomechanical processes K1 Predictive models K1 Thermal management K1 Flip-chip devices K1 Heat sinks K1 embedded cooling K1 microchannel heat sink K1 thermal stress K1 flip-chip SP 1805 OP 1810 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00284 DO https://doi.org/10.1109/ECTC51906.2022.00284 SF ELIB - SuUB Bremen
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