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Buried Power Rails and Nano-Scale TSV: Technology Boosters ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jourdain, Anne ; Stucchi, Michele ; Van der Plas, Geert.. - p. 1531-1538 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00244