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1 Ergebnisse
1
Buried Power Rails and Nano-Scale TSV: Technology Boosters ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Jourdain, Anne
;
Stucchi, Michele
;
Van der Plas, Geert
.. - p. 1531-1538 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00244
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Buried Power Rails and Nano-Scale TSV: Technology Boosters for Backside Power Delivery Network and 3D Heterogeneous Integration
UL https://suche.suub.uni-bremen.de/peid=ieee-9816590&Exemplar=1&LAN=DE A1 Jourdain, Anne A1 Stucchi, Michele A1 Van der Plas, Geert A1 Beyer, Gerald A1 Beyne, Eric YR 2022 SN 2377-5726 K1 Rails K1 Manufacturing processes K1 Metallization K1 Lithography K1 Routing K1 Silicon K1 Business process re-engineering K1 Power Delivery Network K1 buried rails K1 nano-TSV K1 extreme -wafer thinning SP 1531 OP 1538 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00244 DO https://doi.org/10.1109/ECTC51906.2022.00244 SF ELIB - SuUB Bremen
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