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Low Temperature Fine-pitch Cu-Cu Bonding Using Au Nanoparti..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Fang, Jun-Peng ; Cai, Jian ; Wang, Qian... - p. 701-706 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00117