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1 Ergebnisse
1
Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Mic..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lin, Yung-Sheng
;
Hung, Yun-Ching
;
Kao, Chin-Li
... - p. 177-181 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00038
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816593&Exemplar=1&LAN=DE A1 Lin, Yung-Sheng A1 Hung, Yun-Ching A1 Kao, Chin-Li A1 Lai, Chung-Hung A1 Shih, Po-Shao A1 Huang, Jeng-Hau A1 Tarng, David A1 Kao, C. Robert YR 2022 SN 2377-5726 K1 Scanning electron microscopy K1 Electric potential K1 Temperature K1 Loading K1 Hydrogen K1 Process control K1 Plating K1 Die bonding methods and processes K1 Die and package singulation manufacturing K1 Interconnects for high I/O thermo-compression/hybrid bonding K1 Fine-pitch/multi-layer RDL SP 177 OP 181 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00038 DO https://doi.org/10.1109/ECTC51906.2022.00038 SF ELIB - SuUB Bremen
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