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1 Ergebnisse
1
Fracture Simulation of Redistribution Layer in Fan-Out Wafe..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Nagase, Koichi
;
Fujii, Atsushi
;
Zhong, Kaiwen
. - p. 1602-1607 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00255
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of Insulating Polymer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816594&Exemplar=1&LAN=DE A1 Nagase, Koichi A1 Fujii, Atsushi A1 Zhong, Kaiwen A1 Kariya, Yoshiharu YR 2022 SN 2377-5726 K1 Wiring K1 Computational modeling K1 Materials reliability K1 Polyimides K1 Fatigue K1 Reliability engineering K1 Polymers K1 Finite Element Analysis (FEA) K1 Simulation K1 Reliability K1 Delamination K1 Fan-Out Wafer-Level Packaging (FOWLP) K1 Insulating polymer K1 Fatigue crack growth K1 Paris' law K1 threshold energy release rate range SP 1602 OP 1607 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00255 DO https://doi.org/10.1109/ECTC51906.2022.00255 SF ELIB - SuUB Bremen
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