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1 Ergebnisse
1
A hybrid bonding interconnection with a novel low-temperatu..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Lin, Yu-Min
;
Chang, Po-Chih
;
Lee, Ou-Hsiang
... - p. 2128-2134 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00336
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A hybrid bonding interconnection with a novel low-temperature bonding polymer system</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816599&Exemplar=1&LAN=DE A1 Lin, Yu-Min A1 Chang, Po-Chih A1 Lee, Ou-Hsiang A1 Chiu, Wei-Lan A1 Chang, Tao-Chih A1 Chang, Hsiang-Hung A1 Lee, Chia-Hsin A1 Huang, Baron A1 Dong, Mei A1 Tsai, Duo A1 Lee, Chang-Chun A1 Chen, Kuan-Neng YR 2022 SN 2377-5726 K1 Wafer bonding K1 Annealing K1 Temperature K1 Dielectric materials K1 Surface roughness K1 Dielectrics K1 Rough surfaces K1 hybrid bond K1 low temperature K1 photo-imageable dielectric SP 2128 OP 2134 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00336 DO https://doi.org/10.1109/ECTC51906.2022.00336 SF ELIB - SuUB Bremen
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