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1 Ergebnisse
1
Thermal cycling induced interconnect stability degradation ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Young, Kendra
;
Aspandiar, Raiyo
;
Badwe, Nilesh
... - p. 1199-1205 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00192
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Thermal cycling induced interconnect stability degradation mechanism in low melting temperature solder joints</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816602&Exemplar=1&LAN=DE A1 Young, Kendra A1 Aspandiar, Raiyo A1 Badwe, Nilesh A1 Walwadkar, Satyajit A1 Lee, Young-Woo A1 Lee, Tae-Kyu YR 2022 SN 2377-5726 K1 Temperature dependence K1 Lattices K1 Crystals K1 Thermal analysis K1 Microstructure K1 Soldering K1 Thermal stability K1 Low melting temperature solder K1 microstructure Electron backscatter diffraction (EBSD) K1 thermal cycling SP 1199 OP 1205 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00192 DO https://doi.org/10.1109/ECTC51906.2022.00192 SF ELIB - SuUB Bremen
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