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1 Ergebnisse
1
Tracking in-die mechanical stress through silicon embedded ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Saxena, Sharad
;
Hess, Christopher
;
Quarantelli, Michele
... - p. 723-728 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00121
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Tracking in-die mechanical stress through silicon embedded sensors for advanced packaging applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816606&Exemplar=1&LAN=DE A1 Saxena, Sharad A1 Hess, Christopher A1 Quarantelli, Michele A1 Piadena, Alberto A1 Weiland, Larg A1 Vallishayee, Rakesh A1 Yu, Yuan A1 Ciplickas, Dennis A1 Brozek, Tomasz A1 Strojwas, Andrzej YR 2022 SN 2377-5726 K1 Temperature measurement K1 Semiconductor device measurement K1 Semiconductor device reliability K1 Packaging K1 Silicon K1 Manufacturing K1 Reliability K1 Mechanical Stress K1 Embedded Sensor K1 Advanced Packaging K1 Chiplets K1 Heterogeneous Integration K1 In-field monitoring SP 723 OP 728 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00121 DO https://doi.org/10.1109/ECTC51906.2022.00121 SF ELIB - SuUB Bremen
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