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1 Ergebnisse
1
Self-healing of Interconnect Cracks for Reliable and Defect..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Hassan, Akeeb Yunus
;
Banerjee, Reshmi
;
Tomitaka, Asahi
. - p. 1556-1561 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00248
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Self-healing of Interconnect Cracks for Reliable and Defect-Free Smart Manufacturing of Flexible Packages
UL https://suche.suub.uni-bremen.de/peid=ieee-9816609&Exemplar=1&LAN=DE A1 Hassan, Akeeb Yunus A1 Banerjee, Reshmi A1 Tomitaka, Asahi A1 Raj, Pulugurtha Markondeya YR 2022 SN 2377-5726 K1 Heating systems K1 Process design K1 Encapsulation K1 Visualization K1 Technological innovation K1 Bending K1 Three-dimensional printing K1 interconnect K1 flexible K1 self-healing K1 silver K1 elastomer SP 1556 OP 1561 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00248 DO https://doi.org/10.1109/ECTC51906.2022.00248 SF ELIB - SuUB Bremen
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