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Study of reliable via structure for Fan Out Panel Level Pac..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Da-Hee ; Lee, Jae-Ean ; Choi, Gyujin... - p. 819-823 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00134