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1 Ergebnisse
1
Multi-terminal Ultra-thin 3D Nanoporous Silicon Capacitor T..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Jatlaoui, Mohamed Mehdi
;
Hidaka, Seiji
;
Kasai, Ryo
... - p. 908-913 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00148
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Multi-terminal Ultra-thin 3D Nanoporous Silicon Capacitor Technology for High-Speed Circuits Decoupling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816616&Exemplar=1&LAN=DE A1 Jatlaoui, Mohamed Mehdi A1 Hidaka, Seiji A1 Kasai, Ryo A1 Kubota, Sho A1 Takesawa, Masato A1 Muller, Charles A1 Lallemand, Florent A1 Abe, Shunsuke A1 Takeuchi, Takashi A1 Matsuno, Hitoshi YR 2022 SN 2377-5726 K1 Performance evaluation K1 Silicon devices K1 Three-dimensional displays K1 Voltage fluctuations K1 Capacitors K1 Packaging K1 Market research K1 3D Nanoporous Silicon capacitors K1 Mobile K1 HPC K1 Multi-terminal Si-Cap K1 Low ESL K1 High-density K1 low ESR K1 low profile K1 PDN Impedance SP 908 OP 913 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00148 DO https://doi.org/10.1109/ECTC51906.2022.00148 SF ELIB - SuUB Bremen
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