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Mechanical properties and microstructures of Cu/In-48Sn all..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kang, Dong Gil ; Deuk Min, Kyung ; Jung, Hak San... - p. 2206-2210 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00348