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1 Ergebnisse
1
Cracking-Less Heat-Resistant Electroless Ni-P Plating Film ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Hsieh, Ming-Chun
;
Chen, Chuantong
;
Suetake, Aiji
... - p. 1300-1303 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00209
RT T1
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
: T1
Cracking-Less Heat-Resistant Electroless Ni-P Plating Film for Wide Bandgap Power Modules
UL https://suche.suub.uni-bremen.de/peid=ieee-9816624&Exemplar=1&LAN=DE A1 Hsieh, Ming-Chun A1 Chen, Chuantong A1 Suetake, Aiji A1 Zhang, Zheng A1 Suganuma, Katsuaki A1 Saito, Ryuji A1 Hasegawa, Norihiko A1 Hashizume, Kei A1 Otsuka, Kuniaki YR 2022 SN 2377-5726 K1 Heating systems K1 Resistance K1 High-temperature superconductors K1 Temperature K1 Heat treatment K1 Photonic band gap K1 Plating K1 power device K1 heat-resistant K1 reliability K1 electroless Ni-P plating SP 1300 OP 1303 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00209 DO https://doi.org/10.1109/ECTC51906.2022.00209 SF ELIB - SuUB Bremen
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