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TSV-less Power Delivery for Wafer-scale Assemblies and Inte..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ren, Haoxiang ; Pal, Saptadeep ; Ouyang, Guangqi... - p. 1934-1939 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00303