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1 Ergebnisse
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Plating and Recrystallization of Galvanic Cu Films on Roll ..:
, In:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
,
Bernhard, T.
;
Massey, R.
;
Li, Zhiou
... - p. 1413-1421 , 2022
Link:
https://doi.org/10.1109/ECTC51906.2022.00227
RT T1 <cTitle>2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Plating and Recrystallization of Galvanic Cu Films on Roll Annealed and Polycrystalline Cu Foils and the Effect of Intermediate Electroless Cu Layers</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9816638&Exemplar=1&LAN=DE A1 Bernhard, T. A1 Massey, R. A1 Li, Zhiou A1 Schulze, Joerg-F. A1 Klaeden, K. A1 Zarwell, S. A1 Steinhaeuser, E. A1 Bruening, F. YR 2022 SN 2377-5726 K1 Additives K1 Semiconductor device reliability K1 Crystals K1 Plating K1 Surface roughness K1 Epitaxial growth K1 Surface texture K1 HA-Cu foil K1 electroless Cu K1 galvanic Cu K1 epitaxial growth K1 surface facets K1 reliability SP 1413 OP 1421 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51906.2022.00227 DO https://doi.org/10.1109/ECTC51906.2022.00227 SF ELIB - SuUB Bremen
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