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300mm Full Thickness Si-Based IC Singulation Using Plasma D..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Surapaneni, R. ; Hamlin, B. S. ; Chiu, J.... - p. 1019-1024 , 2022
Link: https://doi.org/10.1109/ECTC51906.2022.00166